Opportunity

University of Missouri Ionwave #27-0052 Addendum 1

One ALD system for Missouri S&T’s semiconductor engineering cleanroom

Posted

October 20, 2026

Respond By

November 03, 2026

Identifier

27-0052 Addendum 1

NAICS

334516, 423490

The University of Missouri is seeking one Atomic Layer Deposition System for Missouri S&T’s Semiconductor Engineering cleanroom program. - Buyer: University of Missouri, UM Procurement, for Missouri S&T. - OEMs and vendors: No equipment manufacturers, OEMs, or resellers are named. TMA, TDMAT, BDEAS, and TEMAHf are precursor chemicals, not vendors. - Main equipment: One Atomic Layer Deposition (ALD) System, with thermal ALD and remote plasma PEALD, a loadlock, and capacity for substrates from 1 cm × 1 cm coupons through 6-inch wafers. - Precursors and processes: Four sources—TMA, TDMAT, BDEAS, and TEMAHf—are acceptable. The system must support Ti, Hf, and Al precursors and initial recipes for Al2O3, HfO2, SiO2, TiO2, TiN, and AlN. - Technical requirements: Heated precursor bubblers and delivery lines; H2O oxidant; O2 plasma; N2, O2, Ar, and H2O process gases; preferably room temperature to 400°C or higher wafer temperature; and a pump and foreline. Supplier must provide utility documentation and detailed system literature. - Other requested pricing: Software/hardware if applicable, maintenance/service agreement, training and installation if applicable, shipping/freight, and a discount. The system must include a 24-month warranty. - Contract term: Two years from award, with pricing firm during the initial term.

Description

The University of Missouri requests bids for furnishing and delivery of one Atomic Layer Deposition System for undergraduate courses in the new cleanroom of Missouri S&T’s Semiconductor Engineering bachelor’s degree program. Requirements include thermal ALD and remote plasma PEALD, a loadlock, precursor sources, heated precursor bubblers and delivery lines, specified process gases, and capability to deposit Al₂O₃, HfO₂, SiO₂, TiO₂, TiN, and AlN. The system must support substrates from 1 cm × 1 cm coupon pieces through 6-inch wafers and includes a requested 24-month warranty and utility documentation. Bids must be submitted through the University of Missouri System’s electronic bidding platform by November 3, 2026, at 2:00 PM CT; the buyer states four precursor sources are acceptable in response to a bidder question.

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