SAM #N0017326P2436

Award for Semiconductor Die Bonding and Vacuum Packaging System

This award announcement concerns the Naval Research Laboratory (NRL), under the Department of Defense and Department of the Navy. - Contract awarded to COOK AND WEIL, INC. for a Semiconductor Die Bonding and Vacuum Packaging System - Award made using simplified commercial item procedures (FAR subpart 13.5) - Contract value: $672,985 - No specific part numbers, models, or purchase quantities provided - Place of performance: NRL facility, Washington, DC - No unique technical requirements or specifications detailed - COOK AND WEIL, INC. is the only OEM/vendor mentioned

Description

This contract is awarded to COOK AND WEIL, INC. under simplified procedures for certain commercial items included in FAR subpart 13.5 for Semiconductor Die Bonding and Vaccuum Packaging System.

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