# SAM #N0017326P2436

Award for Semiconductor Die Bonding and Vacuum Packaging System

**Buyer:** NRL
**Posted:** September 16, 2026
**Identifier:** N0017326P2436
**NAICS:** 333993, 334413

This award announcement concerns the Naval Research Laboratory (NRL), under the Department of Defense and Department of the Navy.
- Contract awarded to COOK AND WEIL, INC. for a Semiconductor Die Bonding and Vacuum Packaging System
- Award made using simplified commercial item procedures (FAR subpart 13.5)
- Contract value: $672,985
- No specific part numbers, models, or purchase quantities provided
- Place of performance: NRL facility, Washington, DC
- No unique technical requirements or specifications detailed
- COOK AND WEIL, INC. is the only OEM/vendor mentioned

### Description

<p>This contract is awarded to COOK AND WEIL, INC.&nbsp;under simplified procedures for certain commercial items included in FAR subpart 13.5 for Semiconductor Die Bonding and Vaccuum Packaging System.</p>

[View original listing](https://sam.gov/opp/68c5094fd20d471388d9a1346950e9f7/view)