CanadaBuys #26-58197

Integrated Logitech wafer bonding, lapping, polishing, measurement, and cleaning equipment

The National Research Council of Canada’s Canadian Photonics Fabrication Centre is seeking an integrated equipment package for photonics wafer processing. - Government buyer: National Research Council of Canada (NRC), Canadian Photonics Fabrication Centre (CPFC). - OEM and supplier: Logitech Limited is the named supplier and manufacturer. The equipment must come from one manufacturer, use common system-management software, and integrate with the CPFC’s existing Logitech equipment and processes. - Requested equipment: - 3 modular wafer bonding systems, part number 1MWB8, for wafers up to 8 inches. - 1 LP70C precision lapping and polishing machine, part number 1LB75. - 1 PP6GT precision polishing jig with vacuum adaptor, part number 1PP62. - 1 CG10 electronic thickness measurement gauge, part number 1CG10, for samples up to 300 mm. - 1 GI20 flatness measurement system with touchscreen. - 1 solvent vapour still assembly for wafer cleaning, part number 1SVC2, with the required 1ACCS-9500 accessory kit and interchangeable dippers for 100, 150, 200, and 300 mm wafers. - Notable requirements: The package supports the CPFC’s 4-inch wafer-processing needs and transition to four-wafer processing. Equipment requirements include integrated operation and shared software; specified capabilities include programmable bonding controls, software-supported lapping and polishing, thickness and flatness measurement, and controlled solvent cleaning. - Delivery/performance: Equipment delivery is required, but the English and French attachments state different delivery deadlines. No separate contract duration or option periods are stated; the deadline should be confirmed.

Description

The National Research Council of Canada (NRC) requires lapping, polishing, bonding, measurement, and solvent-cleaning equipment for the Canadian Photonics Fabrication Centre’s modernization to 4-inch wafer processing. The required equipment includes three Modular Wafer Bonding Systems and one each of an LP70 multi-station lapping and polishing system, PP6GT polishing jig with vacuum adaptor, CG10 contact measurement gauge, and Solvent Vapour Cleaner. The equipment is intended to replace aging tools, support integrated photonics manufacturing, maintain production capability, and reduce production risks, maintenance costs, and downtime. This is an Advance Contract Award Notice identifying Logitech Limited as the pre-identified supplier; other suppliers may submit statements of capabilities by November 16, 2026 at 14:00 EST.

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