Opportunity

University of Missouri Ionwave #27-0053 Addendum 1

One e-beam evaporator system for Missouri S&T semiconductor engineering instruction

Posted

October 20, 2026

Respond By

November 03, 2026

Identifier

27-0053 Addendum 1

NAICS

423690

The University of Missouri is seeking one e-beam evaporator system for semiconductor engineering cleanroom instruction. - Government buyer - University of Missouri; sub-agency: Missouri S&T; office: UM Procurement. - The equipment is for Missouri S&T’s Semiconductor Engineering bachelor’s program in Rolla, Missouri. - OEMs and vendors - No equipment manufacturer, OEM, or bidding vendor is named in the opportunity. - Requested equipment - One e-beam evaporator system; no part number is specified. - Quote a 6-inch wafer dome and 6-inch chip-holder plates. If adjustable z-motion is unavailable, quote adjustable-angle tooling. - Optional bid items include software/hardware, maintenance or service, training, installation, and shipping/freight. - Notable technical requirements - Four-pocket deposition to support multiple materials without breaking vacuum; specified film materials include Al, Ni, Ti, Ag, Au, Cu, W, Ta, and SiO2. - Support substrates from 1 cm × 1 cm coupons through 6-inch wafers, with film uniformity below 5% across a 6-inch substrate and run-to-run repeatability within ±3%. - Include substrate-holder rotation and adjustable z-motion, a crystal thickness/rate monitor, base pressure in the 10⁻⁷ Torr range or better, a turbo pump (cryopump optional), and a closed-loop chiller. - Include a 24-month warranty and equipment utility documentation; detailed system literature is requested. - Period and pricing - Contract term: two years from award, with pricing firm for the initial term. No specific start or end date is stated. - The equipment warranty is 24 months.

Description

The University of Missouri requests bids for furnishing and delivering one eBeam Evaporator System for undergraduate coursework in the new cleanroom of Missouri S&T’s Semiconductor Engineering bachelor’s degree program. Requirements include four-pocket, multi-material deposition without breaking vacuum, substrate capability from 1 cm × 1 cm coupons to 6-inch wafers, specified film uniformity and run-to-run repeatability, adjustable substrate-holder rotation and z-motion, and a crystal thickness/rate monitor. The requested system also includes a base pressure target in the 10⁻⁷ Torr range or better, a turbo pump (with cryopump as an option), a closed-loop chiller, a 24-month warranty, and utility documentation. Bids must be submitted through the University of Missouri System’s electronic bidding platform by November 3, 2026, at 2:00 PM CT.

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