University of Missouri Ionwave #27-0053

University of Missouri seeks one eBeam Evaporator System for Missouri S&T

The University of Missouri is seeking one eBeam Evaporator System for hands-on semiconductor engineering instruction in Missouri S&T’s new cleanroom. - Government buyer: University of Missouri, UM Procurement, for Missouri S&T; buyer contact listed as Amanda Barnes. - OEMs and vendors: No equipment manufacturer, OEM, reseller, or vendor is named in the materials. - Requested equipment: One eBeam Evaporator System, with no part number specified. It must provide four-pocket deposition without breaking vacuum, with 15 cc pocket capacity, for Al, Ni, Ti, Ag, Au, Cu, W, Ta, and SiO2. The system must accommodate substrates from 1 cm × 1 cm coupons through 6-inch wafers and include a six-wafer dome and 6-inch chip holder plates. - Performance and configuration: Film uniformity must be below 5% across six substrates, with run-to-run repeatability within ±3%. The substrate holder must rotate and move along the z-axis; if z-axis adjustment is unavailable, adjustable-angle tooling should be quoted. Other requirements include a crystal thickness/rate monitor, base pressure in the 10⁻⁷ Torr range or better, a turbo pump (with a cryopump option), a closed-loop chiller, and a 24-month warranty. - Additional requested items and services: One software/hardware line item, if applicable; optional maintenance/service agreement, training, installation, and shipping/freight. Service terms and coverage and detailed system literature are requested. - Notable use: Equipment is intended for cleanroom coursework and hands-on microfabrication training in Missouri S&T’s Semiconductor Engineering bachelor’s degree program.

Description

The University of Missouri requests bids for furnishing and delivery of one eBeam Evaporator System for undergraduate courses in Missouri S&T’s Semiconductor Engineering bachelor’s program and new cleanroom. Required features include four-pocket deposition, specified film compatibility, substrate capacity from 1 cm × 1 cm coupons to 6-inch wafers, film uniformity below 5%, run-to-run repeatability below +/-3%, substrate rotation and z-motion adjustment, a crystal thickness/rate monitor, turbo pump, closed-loop chiller, and a 24-month warranty. The bid invitation also identifies a two-year contract period and requests detailed system literature. Bids must be submitted through the University of Missouri System electronic bidding platform by November 3, 2026.

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