SAM #MicroelectronicsSourcingforTYAD2

Army Market Research for High-Volume Microelectronics Sourcing

The Army is conducting market research for Tobyhanna Army Depot on reliable, high-volume microelectronics sourcing for circuit card assembly production. - Government buyer: Department of the Army, Army Contracting Command (ACC), supporting Tobyhanna Army Depot. - Purpose: Identify original component manufacturers (OCMs) and authorized Tier-1 distributors working directly with manufacturers that can support sustained, high-volume supply of commercial, industrial, and defense-grade microelectronics. - Representative products: MLCCs, precision and current-sense resistors, power-management ICs, power MOSFETs and diodes, microcontrollers, inductors, and interconnects. The listed part numbers are examples, not quantified orders. - Part numbers and quantities: See the product line items below. No quantities are stated. - Notable requirements: Suppliers should describe production capacity and allocations, minimum lead times, traceability and chain of custody, anti-counterfeiting controls, packaging assurances, and quality-system certifications. AEC-Q200 qualification is preferred for the listed MLCC examples. - OEMs and vendors: No manufacturer or vendor is explicitly named in the provided notice or attachment summary; vendor attribution is therefore not assigned to the example part numbers. - Opportunity status: This is market research, not a purchase commitment. No specific order value or period of performance is provided.

Description

The U.S. Army Contracting Command (ACC) is issuing this Request for Information (RFI) as market research to identify qualified Original Component Manufacturers (OCMs) and their Tier-1 direct distributors (directly working with manufacturer) capable of supplying commercial-off-the-shelf (COTS), industrial, and defense-grade microelectronics in sustained, large-scale production volumes for Circuit Card Assembly (CCA) integration.

The primary objective is to transition from spot-market, broker-dependent, and decentralized procurement models toward resilient, long-term, direct-tier relationships with primary component fabricators and direct suppliers. The Government seeks insights into volume production capacity, minimum lead times, wafer/die allocations, packaging assurances, and transparent chain-of-custody protocols.

Disclaimer: This RFI is published solely for information and planning purposes. It does not constitute a Request for Proposal (RFP), Invitation for Bid (IFB), or an obligation on the part of the Government to acquire any products or services. The Government will not reimburse respondents for any costs incurred in preparing responses.

See Attachment 1 - Request for Information for a full description of the Government's requirement for High-Volume Microelectronics Sourcing: Direct Manufacturer & Tier-1 Production Supply Chains.

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