Opportunity
University of Missouri Ionwave #27-0019 Addendum 1
University of Missouri Solicitation: Rapid Thermal Process System for Semiconductor Engineering Program
Posted
August 27, 2026
Respond By
September 18, 2026
Identifier
27-0019 Addendum 1
NAICS
334413, 333242
The University of Missouri is seeking bids for a Rapid Thermal Process System to support hands-on microfabrication training in its Semiconductor Engineering Bachelor's program at Missouri S&T. - Government Buyer: - University of Missouri, UM Procurement office - Missouri S&T Semiconductor Engineering Program - Products Requested: - Rapid Thermal Process System & Accessories - Supports substrates from 1 cm x 1 cm up to 6-inch wafers - Manual substrate loading - Three MFC controlled process gas lines (N2, Ar, forming gas) - Maximum temperature: 1200°C - Programmable ramp rates: 100°C/sec for heating and cooling - Temperature measurement and control - Recirculating chiller - Software/Hardware package (if applicable) - Discount options - Services Requested: - Training (if applicable) - Installation (if applicable) - Shipping/freight (including duties, fees, tariffs) - Maintenance/service agreement - Unique Requirements: - System must be suitable for undergraduate cleanroom courses - Compliance with digital accessibility standards (WCAG 2.2 A and AA) - Missouri firm preference and insurance coverage required - Payment options include Single Use Account (SUA), ACH, and check - No specific OEMs or vendors are named; qualified manufacturers are encouraged to bid.
Description
The University of Missouri is requesting bids for the furnishing and delivery of a Rapid Thermal Process System. This system will be used in undergraduate courses for hands-on training in microfabrication as part of the Semiconductor Engineering Bachelor's degree program at Missouri S&T. The system must meet specific requirements including rapid thermal annealing of substrates up to 6-inch diameter wafers, manual substrate loading, controlled process gas lines, and programmable heating and cooling rates. Bids must be submitted electronically through the University of Missouri System's bidding platform and comply with the terms and conditions provided.