PIEE #W52P1J26R0001

RFI for Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies

The W1DF CCDC AV Missile Center is seeking industry input for secure packaged microelectronic components, printed circuit boards, and supporting technologies. - Government Buyer: - W1DF CCDC AV Missile Center - OEMs and Vendors: - No specific OEMs or vendors mentioned - Products/Services Requested: - Secure packaged microelectronic components - Printed circuit boards - Supporting technologies - No part numbers or quantities specified - Unique/Notable Requirements: - Respondents must provide technical, price, delivery, and market information - Material Safety Data Sheet (MSDS) required with submissions (per FAR Clause 52.223-3) - This is a Request for Information (RFI) for market research, not a solicitation - Potential for future procurement opportunities, including Other Transaction Agreements (OTAs)

Description

Sources Sought RFI - Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies This Request for Information (RFI) is issued solely for information and planning purposes. This is not a solicitation. In accordance with FAR 15.201(e), the US Government (USG) seeks technical, price, delivery, other market information, or capabilities for planning purposes to inform potential future solicitation opportunities. Responses to this RFI are not offers and cannot be accepted by the USG to form a binding contract. All information received in response to this RFI that is marked as proprietary will be handled accordingly. Responders are solely responsible for all expenses associated with responding to this RFI. Based on the results of this RFI, the USG may seek to establish Other Transaction Agreements (OTAs) or other procurement opportunities related to this RFI. (See also FAR Part 10 for market research policy.)

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