Opportunity
Columbus Ionwave ##26-10 Addendum 2
Overlay Phase 2 Road Engineering and Paving Project for City of Columbus, Indiana
Posted
August 10, 2026
Respond By
August 25, 2026
Identifier
#26-10 Addendum 2
NAICS
237310, 237990, 238190
The City of Columbus, Indiana is seeking bids for the Overlay Phase 2 road engineering and paving project. - Government Buyer: - City of Columbus, Indiana Board of Public Works and Safety - Contact: Andrew Beckort - OEMs and Vendors: - Tensar (manufacturer of InterAx NX850 geogrid) - Products and Materials Requested: - Multiple milling services: 1.5", 4", and 6" depths (51,200 SYD, 17,700 SYD, 5,300 SYD) - Hot Mix Asphalt (HMA) materials: - 25mm HMA Base, Type B (1,451 TON) - 19mm HMA Intermediate, Type C (2,430 TON) - 9.5mm HMA Surface, Types B and C (4,660 TON, 1,500 TON) - 5" 25mm Base, Type B, Patching with 5" Milling (4,362 TON) - Common excavation (915 CYD) - Tensar InterAx NX850 geogrid (3,650 SYD) - Compacted #53 stone (2,410 TON) - Standard flattop drywell (1 EA) - Casting adjustment to grade (80 EA) - Thermoplastic pavement markings: - Yellow line, 4" (4,060 LFT) - Stop line, white, 24" (1,008 LFT) - Crosswalk line, white, 6" (1,145 LFT) - Crosswalk line, white, 24" (350 LFT) - Lane indication arrow (12 EA) - Services Requested: - Engineering and construction management for road overlay and associated works - Unique/Notable Requirements: - Bidders must submit a notarized Comprehensive Compliance Form (CCF) covering affirmative action, Iran contract disqualification, drug-free workplace, OSHA/IOSHA compliance, and employment eligibility verification - Bid bond or certified check for 10% of bid amount required - 100% performance and payment bond required for successful bidder - All bids must be submitted electronically via Euna Procurement (Ion Wave) - Period of Performance: - Work to begin after contract award and must be completed by project deadline; liquidated damages apply for late completion
Description
This solicitation is for an itemized bid for engineering services related to the Overlay Phase 2 project in Columbus, Indiana. The project involves various milling and paving activities, including 1.5" milling, 4" milling, 6" milling, and multiple types of HMA base and surface applications. Bidders are required to submit a notarized Comprehensive Compliance Form and a bid bond of 10% of the bid amount. The contract requires a 100% performance and payment bond, and work is expected to start promptly upon contract award with completion by June 18, 2027.