Opportunity
SAM #W52P1J26R0001
Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies Solicitation
Buyer
Department of the Army
Posted
August 17, 2026
Respond By
September 16, 2026
Identifier
W52P1J26R0001
NAICS
541715, 334412, 334418, 334419
This opportunity is a solicitation from the Department of the Army for secure packaged microelectronic components, printed circuit boards, and supporting technologies. - Solicitation title: 'Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies' - Reference number: W52P1J26R0001 - Issued by: Department of the Army, Department of Defense - No specific OEMs, vendors, products, or part numbers are listed in the notice - All technical requirements and procurement details are contained in the attached document 'R2.0_SS_RFI_SUBMISSION_v1.2.pdf' - Place of performance: United States - Interested parties must review the attachment for full specifications and submission instructions - No unique requirements or quantities are stated in the notice text
Description
Refer to the Attachment, R2.0_SS_RFI_SUBMISSION_v1.2.