Opportunity
SAM #80NSSC26939631Q
Sole Source PIC Packaging and FAU Procurement for NASA Ames Research Center
Buyer
NASA Shared Services Center
Posted
August 10, 2026
Respond By
August 12, 2026
Identifier
80NSSC26939631Q
NAICS
334418, 813920
NASA Ames Research Center is seeking specialized packaging services for 8 photonic integrated circuits (PICs). - Sole source procurement to Silitronics Solutions Inc. for PIC packaging and related engineering services - Scope includes: - Packaging of 8 PICs with wire bonding to printed circuit boards (PCBs) - Fiber alignment and bonding of 12 fiber array units (FAUs) (including 4 for process development) - Multiple non-recurring engineering (NRE) tasks: setup, work holder fabrication, inspections, process development, gripper and spacer fabrication, quality tests, and final optical assembly report - Detailed assembly and testing processes, including cleaning, epoxy dispensing, automated wire bonding, active alignment, UV curing, and performance measurement - Performance at NASA Ames Research Center, managed by NASA/NSSC - Estimated contract period: 16-18 weeks from award - NAICS code: 813920 - Interested parties may submit capability statements, but NASA intends to proceed with sole source award unless competitive alternatives are identified - Silitronics Solutions Inc. is identified as the only provider capable of meeting these requirements - No specific part numbers provided; quantities are 8 PICs and 12 FAUs - Contract includes both product procurement (FAUs) and extensive engineering services
Description
NASA/NSSC has a requirement for Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs.
NASA/NSSC intends to issue a sole source contract to silitronics solutions inc under the authority of FAR 12.102(a). It has been determined that silitronics solutions inc 2388 walsh ave Santa Clara California 95051 – 1301 United States is the sole provider of Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs.
NASA/NSSC will be the procuring center for this effort. Performance will be located at NASA/ Ames Research Center (ARC). The Government intends to acquire Commercial items or services using the provisions, clauses and procedures prescribed in FAR Part 12 for Commercial
The NAICS Code for this procurement is 813920.
Interested organizations may submit their capabilities and qualifications to perform the effort in writing to the identified point of contact not later than 3:00 p.m. Central Standard Time on 8/12/2026. Such capabilities/qualifications will be evaluated solely for the purpose of determining whether or not to conduct this procurement on a competitive basis. A determination by the Government not to compete this proposed effort on a full and open competition basis, based upon responses to this notice, is solely within the discretion of the government. Oral communications are not acceptable in response to this notice. NASA FAR Supplement Clause 1852.215-84, Ombudsman, is applicable.
The Center Ombudsman for this acquisition can be found at https://www.hq.nasa.gov/office/procurement/regs/Procurement-Ombuds-Comp-Advocate-Listing.pdf . Primary Point of Contact: Kacey.l.hickman@nasa.gov