University of Missouri Ionwave #27-0021 Addendum 1

University of Missouri Solicits Double Side Mask Alignment System for Semiconductor Training

The University of Missouri, through its UM Procurement office at Missouri S&T, is seeking bids for a Double Side Mask Alignment System to support undergraduate microfabrication training in its new cleanroom for the semiconductor engineering program. - Government Buyer: - University of Missouri, Missouri S&T, UM Procurement - Products & Services Requested: - Double Side Mask Alignment System & Accessories - Must process substrates from 1 cm x 1 cm up to 6-inch wafers - Top side alignment accuracy: 0.5 μm; bottom side alignment accuracy: 2.0 μm - Supports proximity, soft, hard, and vacuum contact exposure modes - Includes alignment stage with X, Y, and Theta precision micrometers - UV LED exposure source required - Must operate without a raised or sub floor - Software/Hardware package (if applicable) - Maintenance & Service Agreement - Training (if applicable) - Installation (if applicable) - Shipping/Freight (including duties, fees, and tariffs) - Discount options requested - Unique/Notable Requirements: - System will be used for undergraduate education in a cleanroom environment - Vendors must provide detailed product literature and complete security/authentication documentation (HECVAT and IdP Questionnaire) - No specific OEMs or vendors are named in the solicitation - Contract term is one year from award

Description

The University of Missouri is requesting bids for the furnishing and delivery of a Double Side Mask Alignment System. This equipment will be used to provide students with hands-on training on microfabrication in undergraduate courses offered in the new cleanroom by the semiconductor engineering Bachelor's degree program at Missouri S & T. The system must meet specific requirements including processing substrates from 1 cm x 1 cm pieces up to 6-inch diameter wafers, capable of both top and bottom side alignment, and supporting various exposure modes. Bids must be submitted electronically through the University of Missouri System's bidding platform and are subject to the terms and conditions provided.

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