Opportunity
Federal Register #2026-15937
Proposed Production of Semiconductor Dies for Hard Disk Drive Heads by Western Digital in FTZ 18
Posted
August 06, 2026
Identifier
2026-15937
NAICS
334412
This notification concerns proposed production activity by Western Digital Technologies, Inc. at its San Jose and Fremont, California facilities within Foreign-Trade Zone 18. - Government Buyer: - Department of Commerce, Foreign-Trade Zones Board - OEMs and Vendors Mentioned: - Western Digital Technologies, Inc. (primary OEM) - EMD Performance Materials Corp - Dupont - JSR Micro, Inc. - Fujifilm Electronic Materials LLC - Rohm and Haas Electronic Materials LLC - Dow - Kayaku Advanced Materials - Shin-Etsu Chemical Co., Ltd. - Sumitomo Chemical Co., Ltd. - Tokyo Ohka Kogyo Co., Ltd. - Products/Services Requested: - Production of semiconductor dies for hard disk drive heads (duty-free) - Use of various foreign-status materials and components, including: - Photoresists - Metal alloy sputtering targets (metals: Ru, Al, Cr, Co, Ir, B, Fe, Ni, Hf, Ti, Pt, Ag, Mg, Ta, Ge, Mn, Mo, Zr, W, Y, Pd, Nb, Au, Rh, Sm) - Alumina substrates - Adhesion promoters - Unique/Notable Requirements: - Some materials are subject to duties under section 301 of the Trade Act of 1974, depending on country of origin - Materials subject to section 301 must be admitted to the FTZ in privileged foreign status - Public comment period is open for the proposed activity - Compliance with FTZ and trade regulations is required
Description
This notice pertains to a proposed production activity involving semiconductor dies at Western Digital Technologies, located in San Jose and Fremont, California, within Foreign-Trade Zone 18. The production activity is limited to specific foreign-status materials/components and finished products as described in the notification. The proposed finished product is Die for Hard Disk Drive Head, which is duty-free. The notification includes a detailed list of foreign-status materials/components used in the production process. Public comments are invited until September 15, 2026.