SBIR / STTR #DME26BZ05-NV001

Additive Manufacturing for Flexible Electronics – Feasibility Study and Prototype Development

This opportunity invites small businesses to propose innovative additive manufacturing solutions for flexible electronics for the Department of War's Defense Microelectronics Activity (DMEA). - Government Buyer: - Department of War (DoW) - Defense Microelectronics Activity (DMEA) - DMEA Office of Small Business Programs (OSBP) - Scope of Work: - Develop additive manufacturing of electronics (AME) processes, focusing on flexible hybrid electronics and multi-material 3D printing - Design and prototype a Radio Frequency (RF) system using AME technologies - Integrate surface mount components (e.g., QFN, BGA, resistors, inductors, capacitors) and printed passive components onto additively fabricated substrates - Achieve fine interconnect pitch and demonstrate hybrid electronic manufacturing on flexible substrates - Conduct reliability testing to MIL-STD quality and reliability metrics, including thermal stress - Provide detailed reports on manufacturing processes, cost breakdowns, and reliability data - Products/Services Requested: - Phase I: Feasibility study and RF system design using AME technologies - Phase II: Prototype development, testing, and delivery of a functional RF system - Unique Requirements: - Emphasis on cost-effective, reliable alternatives to traditional advanced packaging and substrate fabrication - Must demonstrate manufacturing yield, reliability, and viability for government microelectronics - No specific OEMs, part numbers, or commercial vendors are named; focus is on innovative manufacturing techniques - Estimated contract value: - Phase I: Up to $200,000 - Phase II: Up to $1,340,000

Description

This solicitation seeks the development of additive manufacturing of electronics (AME) processes by small businesses as an alternative to standard commercial advanced packaging and organic substrate fabrication techniques. The goal is to create interconnects between components or between components and printed circuit boards, including the ability to print passive electronic components with specified electrical ratings and tolerances. The project involves a Phase I feasibility study to design a Radio Frequency system using AME technologies, integrating various surface mount components and subjecting the assembled module to reliability tests. The solicitation emphasizes the need for reliability data using MIL-STD quality and reliability metrics to validate AME technologies as viable alternatives for Department of War systems.

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