SAM #385352swk

Fermilab Solicits PCB Assemblies and Electronic Components for Scientific Application

Fermi National Accelerator Laboratory (Fermilab), under the Department of Energy, is seeking proposals for the supply and assembly of printed circuit board (PCB) assemblies for a scientific application. - Government Buyer: - Fermi National Accelerator Laboratory (Fermilab), Department of Energy - Products/Services Requested: - A comprehensive set of electronic components for PCB assembly, including: - Capacitors (ceramic, tantalum, aluminum polymer, multilayer, chip types) - Resistors (various ohm ratings, SMD, chip, thick film, resistor arrays) - Inductors, ferrite beads, and EMI filters - LEDs (green, chip types) - Diodes (Schottky, ESD protection) - Fuses and fuse blocks - Connectors (RJ45 Magjack, USB, QSFP+, board-to-board, headers, SMA, test points, coin cell retainers) - Switches (tactile) - Integrated Circuits (ICs) including DACs, ADCs, voltage references, logic level translators, clock generators, bus transceivers, EEPROM, power switches, and USB controllers - Transformers and baluns - Quantities range from 1 to 119 units per line item, with detailed part numbers and descriptions provided in the Bill of Materials (BOM) - OEMs/Vendors Mentioned: - Kemet, TDK, Murata, Analog Devices, Texas Instruments, Kingbright, Amphenol, Samtec, Molex, Littelfuse, TE Connectivity, Mini-Circuits, Maxim Integrated, NXP Semiconductors, ON Semiconductor, Microchip Technology, Vishay, Panasonic, and others - Notable Requirements: - All technical specifications, part numbers, and assembly details are provided in the attached BOM and technical files - SARC and PUR-466 certifications are required for proposals exceeding $10,000 - Offerors must review the RFP and attachments for full submission and technical requirements - No specific period of performance or contract value is stated in the provided documents

Description

Fermilab is seeking to procure printed circuit board assemblies. Please see attached for Fermilab RFP# 385352swk and associated documentation. Please ensure that you review the RFP document fully, as it outlines how to submit a complete proposal package.

Important information related to this RFP:

Proposal Due Date: 5pm Central August 17, 2026 Proposals exceeding $10k must have a SARC and PUR-466 completed

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