SAM #N0017326QKN05

Naval Research Laboratory Solicitation for Die Bonding and Vacuum Packaging System

The Naval Research Laboratory (NRL), part of the Department of the Navy, is seeking a Die Bonding and Vacuum Packaging System for semiconductor chip packaging and assembly. - Government Buyer: - Naval Research Laboratory (NRL), Washington, DC - Department of the Navy, Code 1100 - Contract Specialist: Kevin Nguyen; Contracting Officer: Jamie L. Dixon - Products/Equipment Requested: - Die Bonding System - Automated attachment of semiconductor die to substrates - Supports die sizes from 2x2 mm to 25x25 mm - Placement accuracy ≤5 micrometers, rate ≥200 placements/hour - Robotic vacuum transfer, image recognition, epoxy dispensing, flip-chip bonding - Optical vision system with look-up and look-down cameras - Vacuum Reflow Furnace - Hermetic sealing of chip carriers with vacuum and process gas control - Programmable temperature profile (25°C to 450°C), heating rate ≥4°C/sec - Vacuum ≤100 milliTorr via dry pumps, chamber size for 4x5 inch mounting plates - Optional Features: - Dry pump (Kashiyama Model 15g preferred) - Dual epoxy dispense system (dot, line, patterned delivery) - Tip cleaning station - Pulsed heat stage (50x55 mm, 25°C/sec ramp rate) - 90-degree die rotation capability - Formic acid delivery system with exhaust remediation - Water-water chiller (65°F or less, ≥1 gal/min flow) - Residual gas analyzer (100 AMU, 100 mTorr to 100 Torr) - Machined tooling for Spectrum Semiconductor Materials LCC04442 and LCC08428 chip carriers - Up to 40 hours of remote process development support - Notable Requirements: - System must handle leadless chip carriers (Spectrum Semiconductor LCC04442 and LCC08428) - Single vendor must provide both die mounting and package sealing equipment - Delivery required within six months after award - All technical specifications detailed in attachments - OEMs and Vendors: - No specific OEMs or vendors are named; Kashiyama is referenced for dry pump preference - Quantities: - 1 Die Bonding System - 1 Vacuum Reflow Furnace - 1 each of optional features (except process development support: up to 40 hours) - Unique Requirements: - High precision placement, automated process, compatibility with specific chip carriers, and advanced process control options - Process development support for hermetic sealing testing at vendor facility

Description

Please see attached combined synopsis/solicitation

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