SAM #MicroelectronicsSourcingforTYAD

Market Research for Microelectronics Sourcing and Supply Chain Capabilities at Tobyhanna Army Depot

The U.S. Army Contracting Command, on behalf of Tobyhanna Army Depot, is seeking information from industry regarding microelectronics sourcing and supply chain capabilities. - Government Buyer: - Department of the Army - Army Contracting Command (ACC) - Tobyhanna Army Depot (TYAD) - Products/Services Requested: - Wide range of microelectronic components, including both commercial-off-the-shelf (COTS) and military-grade parts - Example part numbers: CGA2B3X7R1H104K050BB, CL10A226MO7JZNC, GRM188D72A105KE01J, ERJ-1GNJ102C, STM32G071GBU3, MAX4080SAUA+T, and others - No specific quantities provided; focus is on sourcing capability - Unique/Notable Requirements: - Ability to rapidly source and deliver microelectronic parts, including legacy and hard-to-find items - Supply chain security, including evidence-based assurance and traceability - Counterfeit prevention measures - Diminishing Manufacturing Sources and Material Shortages (DMSMS) management - Trusted supplier status, including DMEA accreditation - OEMs and Vendors: - No specific OEMs named, but part numbers reference a variety of leading microelectronics manufacturers (e.g., Murata, Panasonic, STMicroelectronics, Texas Instruments, Infineon, Maxim Integrated, etc.) - Respondents are asked to provide detailed capability statements addressing all above requirements.

Description

This notice serves as an RFI for Microelectronics Sourcing Capabilities for Tobyhanna Army Depot.  See below.  This information is also provided in the attached document.

1.0 PURPOSE

The U.S. Army Contracting Command (ACC) is issuing this Request for Information (RFI) to identify interested sources and assess industry capabilities regarding the procurement, ordering, and supply chain management of microelectronics, example materials are provided later in the request.

This RFI is issued solely for information and planning purposes—it does not constitute a Request for Proposal (RFP) or a promise to issue an RFP in the future. This RFI does not commit the Government, Army Contracting Command, or Tobyhanna Army Depot to contract for any supply or service whatsoever.

2.0 BACKGROUND

Microelectronics components are the foundation of modern military systems. The Department of Defense (DoD) requires assured access to trusted microelectronics to sustain programs of record and advance future warfighting capabilities. In accordance with recent National Defense Authorization Acts (NDAA) and DoDI 5200.50 ("Assured Access to Trusted Microelectronics"), the Army must manage the risks of supply chain disruptions, diminish reliance on vulnerable foreign sources, and prevent malicious activity or counterfeit parts from entering the supply chain.

Tobyhanna Army Depot (TYAD) is seeking to understand the current commercial and defense industrial base capabilities for ordering and managing microelectronic parts, spanning from legacy (out-of-production) components to state-of-the-art (SOTA) logic chips and radiation-hardened electronics.

3.0 CAPABILITY REQUIREMENTS

The Army is interested in vendors who can demonstrate robust capabilities in the following areas:

Parts Ordering & Sourcing: The ability to rapidly source, procure, and deliver microelectronic parts at necessary volumes to meet Army requirements. This includes sourcing both high-volume commercial-off-the-shelf (COTS) items and low-volume, specialized military-grade components. Examples of materials we are interested in include, but are not limited to, the following part numbers: CGA2B3X7R1H104K050BB (445-6899-1-ND) CL10A226MO7JZNC (1276-7076-2-ND) GRM188D72A105KE01J, GRM188D72A105KE01D, GRM188D72A105KE01W GRM155R60J475ME47D NSR05F40NXT5G ERJ-1GNJ102C ERJ-1GNJ303C, ERJ-1GNF3002C MIC5219-3.3YML-TR DRV8300DRGER STM32G071GBU3, STM32G071GBU6, STM32G071G8U6 GRM21BR61H106KE43L, GRM21BR61H106ME43K, CL21A106KBYQNNE, GMC21X5R106K50NT SM08B-SHLS-TF, SM08B-SRSS-TB MPI4020V2-220-R, 74438356220 BSZ075N08NS5ATMA1, BSZ065N06LS5ATMA1, IAUZ40N06S5N050ATMA1 ERJ-2RKF1133X ERJ-2RKF1742X, RK73H1ETTP1742F AC0402JR-0722RL D1CSA2512M0M30F-T2, MSREM2512S-0L30-F4P0, SSA2512L0M30JPR, CHSA2512R0003F LMR51606YDBVR MAX4080SAUA+T Diminishing Manufacturing Sources and Material Shortages (DMSMS): Proactive management and mitigation strategies for technology end-of-life, including capabilities in reverse engineering, emulation, or authorized aftermarket manufacturing (AAM) of obsolete parts. Evidence-Based Assurance & Traceability: The ability to provide chain of custody and traceability (origin, location of design, manufacturing, packaging, and distribution) to guarantee the provenance and integrity of microelectronics. Counterfeit Prevention: Established systems and processes to detect and avoid counterfeit electronic parts in accordance with DFARS 252.246-7008 and DoDI 4140.67. Trusted Supplier Status: Current standing or ability to become a Defense Microelectronics Activity (DMEA) accredited trusted supplier for the design, manufacturing, test, or distribution of microelectronic components.

4.0 REQUESTED INFORMATION (CAPABILITY STATEMENT OUTLINE)

Interested parties are requested to submit a capability statement addressing the following key sections:

4.1 Company Profile Provide your company name, CAGE code, UEI number, business size/socio-economic status, and a brief description of your primary business focus.

4.2 Ordering Capabilities Describe your systems and processes for accepting, tracking, and fulfilling orders for microelectronic parts. How do you handle surge requirements or urgent (MICAP) requests?

4.3 Supply Chain Security Detail your counterfeit electronic part detection and avoidance system. How do you verify the authenticity of parts sourced from independent distributors or gray market suppliers, if ever utilized?

4.4 DMSMS Management Describe your experience and capabilities in providing form, fit, and function replacements for obsolete or legacy microelectronics.

4.5 DMEA Accreditation Is your facility currently a DMEA-accredited Trusted Supplier? If so, for which specific services (e.g., foundry, packaging, test, broker)? If not, please describe your internal security and trust protocols.

4.6 Traceability How do you maintain and document the chain of custody from the original component manufacturer (OCM) to the final delivery to the Government?

5.0 PRIMARY GOVERNMENT POINTS OF CONTACT

The following individuals serve as the primary points of contact for Tobyhanna Army Depot (TYAD) regarding this market research effort.

Technical Specialist: Ryan Kinger Email: ryan.c.kinger2.civ@army.mil

Program Manager Joseph Dohman Email: joseph.j.dohman.civ@army.mil

6.0 SUBMISSION INSTRUCTIONS

Responses to this RFI/Sources Sought notice must be submitted via email to the Technical Specialist, Ryan Kinger, at ryan.c.kinger2.civ@army.mil no later than August 7th, 2026.

Page Limit: Submissions must be limited to seven (7) pages, including all tables, charts, and company information. Format: Submissions must be provided in Adobe PDF or Microsoft Word format. Proprietary Information: Any proprietary information, trade secrets, or sensitive commercial data must be minimized, and MUST BE CLEARLY MARKED on a page-by-page basis. To assist the review team, please segregate proprietary response details from non-proprietary capabilities.

Disclaimer: All received submissions become the property of the United States Government and will not be returned. The Government is not liable for, nor will it pay for, any costs, efforts, or information associated with preparing responses to this planning notice.

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