SAM #HQ072726QCB04

DMEA Solicitation for Stamping Dies and Sheet Metal Enclosures for Data Transfer Devices

The Defense Microelectronics Activity (DMEA), including its Mechanical Engineering and Analysis Center (MEAC), is seeking contractors to design, fabricate, and deliver sheet metal enclosures and stamping dies for Data Transfer Devices (DTD) used with PCMCIA data cards on military platforms. - Government Buyer: - Defense Microelectronics Activity (DMEA), Mechanical Engineering and Analysis Center (MEAC) - Products and Quantities: - Stamping dies: 1 each for Side A and Side B (design and build) - First article enclosures: 3 each for Side A and Side B - Production sheet metal enclosures: 60,000 units for Side A and 60,000 units for Side B - Shipping of all deliverables - Services Requested: - Program management and technical support, including status reporting, technical interchange meetings, and problem resolution - Notable Requirements: - Deliverables include 3D and 2D drawings for stamping dies - Tooling (dies) must be retained by the contractor for at least one year - The enclosures are replacements for discontinued original parts previously manufactured by Hirose - Supports F-22, C130, and C5 military platforms - Emphasis on quality and price in evaluation - OEMs: - Hirose (original manufacturer of discontinued enclosures, referenced for legacy compatibility) - No specific part numbers are provided; all technical details are in the attached documents.

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