SAM #NB305000-26-01452

NIST Sources Sought for Atomic Layer Deposition (ALD) Batch Reactor

NIST (National Institute of Standards and Technology), under the Department of Commerce, is seeking information from potential suppliers for an Atomic Layer Deposition (ALD) Batch Reactor to support semiconductor R&D in biosensor interface stability. - Government Buyer: - National Institute of Standards and Technology (NIST), Department of Commerce - Products/Services Requested: - One Atomic Layer Deposition (ALD) Batch Reactor - Must support 200 mm wafer substrates - Includes warranty and delivery - Requires advanced precursor manifold and injection systems - Precise wafer heating and uniformity - Integrated software controls - Safety features - End-user installable - Comprehensive documentation required - Excludes vacuum pump and training - OEMs and Vendors: - No specific OEMs or vendors named in the notice - Unique/Notable Requirements: - System must be end-user installable - Must include full documentation - Respondents must provide information on capabilities, prior experience, contract vehicles, and manufacturing location - Strictly a sources sought notice for market research; not a solicitation or award - NAICS Code: 333242 (Semiconductor Machinery Manufacturing)

Description

This is a sources sought notice. The purpose of this notice is to conduct market research and identify potential sources of commercial products/services that satisfy the Government’s anticipated needs.

NIST is seeking responses from all responsible sources, including large and small businesses. The North American Industry Classification System (NAICS) code for this acquisition is 333242– Semiconductor Machinery Manufacturing, with a Small Business Size Standard of 1,500 employees. This notice does not constitute a Request for Proposal (RFP), Request for Quotation (RFQ), Invitation for Bids (IFB), or any commitment by the Government to issue a solicitation or award a contract. The National Institute of Standards and Technology (NIST) will not pay for any information submitted in response to this notice. Submission of information is voluntary and will not result in any obligation on the part of the Government.

NO SOLICITATION DOCUMENTS EXIST AT THIS TIME

Requests for solicitation documents will not receive a response. Respondents shall clearly mark any proprietary or restricted information. In the absence of such markings, NIST will assume unlimited rights to all technical data submitted.

BACKGROUND

The semiconductor supply chain is global, specialized, and interconnected. Chipmakers do business with thousands of individual suppliers that provide the highly complex materials and tools used to produce semiconductors. To address the lack of full visibility into the semiconductors markets supply chain and R&D ecosystem gaps NIST will conduct the measurement science, or metrology, critical to the development of new materials, packaging, and production methods in chip manufacturing. 

The Chemical Process and Nuclear Measurements Group is seeking an Atomic Layer Deposition (ALD) Batch Reactor to support a CHIPS R&D Metrology project focused on characterizing the stability of biofunctional semiconductor interfaces in chip-based biosensors. The reactor will be used to fabricate metal oxide and self-assembled monolayer (SAM) interfaces on 200 mm wafer substrates, which will then be subjected to interface stability and failure analyses using advanced metrology developed at NIST. The ALD reactor is a critical component of this program, aimed at understanding the impact of metal oxide and SAM deposition recipes on biosensor performance and lifetime, and ultimately accelerating biosensor development and improving manufacturing processes critical for commercial viability.

DESCRIPTION OF REQUIREMENT

The contractor shall deliver a quantity of one (1) ALD Batch Reactor inclusive of warranty and FOB Destination delivery that meets all minimum technical specifications identified below:

Technical Specifications for Hardware

Wafer size: Small pieces, up to and including 200 mm Wafer heating: Room temperature to 300 °C (or higher) Wafer uniformity: 1% or better thickness uniformity for Al2O3 on Si (one standard deviation) Chamber heating: Independent of wafer, warm wall capable Carrier gas flow control: Thermal mass flow controller (MFC) Flow controller isolation: Pneumatic valve to isolate MFC for exposure mode Pressure measurement: Heated capacitance diaphragm gauge (CDG) Precursor manifold: 5 sources 5x single-port sources, including one source valve dedicated to ozone All process lines welded stainless steel and fitted with VCR metal seals Precursor manifold heating: 150 °C or higher, jacketed Precursor injection valves: Fast-actuating (<20 ms) diaphragm valves with high-temperature perfluoroalkoxy alkanes (PFA) seats (200 °C) Precursor vessels: 4x 50 mL one-port cylinders with >150 °C manual shutoff valves 4x cylinder heating jackets Each vessel individually heated Temperature control: All zones PID controlled, individual zones for wafer chuck, reactor walls, precursor manifold, precursor vessels, SAM delivery system SAM delivery system: Fixed volume, quantitative delivery of low volatility SAM precursors with integrated CDG endpoint control Optical access: Windows/ports for access to wafer surface for in situ spectroscopic ellipsometry Exposure mode: Computer controlled downstream isolation valve for long exposures Vendor supplied recipes for common ALD processes such as Al2O3, TiO2, ZnO, Ta2O5, HfO2, In2O3 and common SAM processes such as aminopropyl ethoxy silane (APTES), decyltrichlorosilane (DTS), etc. Ozone or O2 plasma source for chamber cleaning: Ozone generator: 200 ng/mL or higher Ozone abatement: Ozone destruct unit for ozone vent/bypass Precursor abatement: Heated high-surface area trap for decomposing unreacted precursor Power requirement: Single phase 120 V, 20 A max Utility requirements: Compressed air for pneumatics, dry inert gas for carrier gas Safety interlocks: emergency-off (EMO) circuit, pushbutton, and hardware watchdog Chemical safety: Vented precursor cabinet Footprint: 24” W x 24” D x <48” H Repairability: All consumable parts such as valves, actuators, gauges, heaters, vessels, critical orifices, O-rings, windows to be user-replaceable Documentation: System to include complete documentation of installed hardware, control system, system commissioning, system operation, and maintenance of consumables/parts Vacuum pump: Not included. Government will use an existing dry pump with at least 10 cubic feet per minute of pumping speed. Installation: System should be end-user installable with assembly being limited to connecting air supply, nitrogen supply, power, and reactant sources. Training: Not included. Operating and maintenance manuals to include all information needed for system startup, operation, and maintenance.

Technical Specifications for Software

Fully integrated computer or PLC controlled system operation Recipe-based control of carrier flow, valve actuation, timed exposure mode, fixed volume SAM delivery, ozone delivery system, all heaters including precursor vessels Real-time monitoring of valve states, temperature zones, pressures, and flow rates Logging of all sensor data during deposition Saving and loading of user-created deposition recipes Safety interlocks to prevent co-dosing of multiple precursors, dosing of any precursors when chamber is not under vacuum, and thermal runaway of heaters

RESPONSE INSTRUCTIONS Interested parties shall submit a written capability statement addressing the following: 1. Company name, address, Unique Entity Identifier (UEI) number, CAGE code, and point-of-contact information 2. Business size and socio-economic status (if applicable) for the NAICS code provided 3. Description of company capabilities relevant to the products/services described above 4. Description of prior experience providing/performing similar products/services described above 5. Identification of applicable contract vehicles (e.g., GSA FSS, GWACs), including contract numbers 6. Any other information the Government should consider for market research purposes 7. State whether the proposed product is manufactured in the United States and if not, state the name of the country where the product is manufactured.

SUBMISSION REQUIREMENTS The information received in response to this notice will be reviewed and considered so that NIST may appropriately solicit for its requirements in the near future.  All responses to this notice must be submitted via email to Sadaf.Afkhami@nist.gov, no later than 10:00 AM EST on July 14, 2026.

Format: Microsoft Word or PDF Page Limit: 12 pages maximum Font: Times New Roman, 11-point Paper Size: 8.5 x 11 inches Margins: Minimum 1 inch on all sides

Any questions regarding this notice must be submitted in writing via email to Sadaf.Afkhami@nist.gov, no later than 12:00 PM EST on July 2, 2026.

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