SAM #80NSSC26936730Q

NASA Sole Source Procurement: Custom Multichip Module Packages for SiC Pressure Sensors

NASA Glenn Research Center, through the NASA Shared Services Center, is seeking to procure specialized Multichip Module (MCM) Packages for Silicon Carbide (SiC) Pressure Sensors via a sole source contract. - Government Buyer: - NASA Glenn Research Center, managed by NASA Shared Services Center - OEM/Vendor: - Sienna Technologies, Inc. (sole source provider) - Products Requested: - Multichip Module Package for SiC Pressure Sensors - Custom aluminum nitride (AIN) circuit board with coefficient of thermal expansion ≤ 4 ppm/C - Precision installation and gold attachment of gold-plated nickel pins - Hermetically brazed AIN receptacle to Kovar tube, rated for up to 700°C - Fully assembled per government drawings and export-controlled technical data - Incorporates government-furnished SiC sensors - Notable Requirements: - Sole source justification: Sienna Technologies previously fabricated this exact configuration, ensuring compatibility and minimizing technical risk - High-temperature tolerance (up to 700°C) - Custom design and assembly per government specifications - Export-controlled technical data applies

Description

** THIS IS A SOLE SOURCE REQUIREMENT ** for Multichip Module Package for SiC Pressure Sensors

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