SAM #N00173-26-RFI-KN02

Market Research for Semiconductor Die Bonding and Vacuum Packaging System

The Naval Research Laboratory (NRL) is seeking information from industry for a Semiconductor Die Bonding and Vacuum Packaging System to support advanced chip packaging research and development. - Government Buyer: - Naval Research Laboratory (NRL), Department of the Navy - Products/Systems Requested: - Die Bonding System - Automated attachment of semiconductor die to substrates - Robotic vacuum transfer, image recognition, epoxy dispensing, and flip-chip bonding - Supports die sizes from 2x2 mm to 25x25 mm - Placement accuracy ≤5 micrometers, rate ≥200 placements/hour - Optical vision system with look-up and look-down cameras - Vacuum Reflow Furnace - Hermetic sealing of chip carriers with vacuum and process gas control - Programmable temperature profiles up to 450°C - Chamber accommodates 4x5 inch mounting plates - Vacuum ≤100 milliTorr using dry pumps - Optional Features/Accessories: - Dry pump (Kashiyama Model 15g preferred) - Dual epoxy dispense system - Tip cleaning station - Pulsed heat stage for eutectic bonding - 90-degree die rotation capability - Formic acid delivery and remediation system - Water-water chiller for process cooling - Residual gas analyzer (RGA) for chamber gas analysis - Machined tooling for Spectrum Semiconductor Materials LCC04442 and LCC08428 chip carriers - Up to 40 hours of remote process development support - Notable Requirements: - System must support leadless chip carriers (Spectrum Semiconductor LCC04442 and LCC08428) - High precision and automation are required for both die bonding and vacuum reflow processes - Vacuum system must use dry pumps and achieve pressures below 100 milliTorr - Process development support is requested as an option - No specific OEMs or vendors are named in the notice or attachments - Respondents are asked to provide capability statements and information about the commerciality of their solutions

Description

NOTE: THIS IS NOT A SOLICITATION OR AN INDICATION THAT A CONTRACTUAL COMMITMENT WILL EXIST AS A RESULT OF THIS RFI. This Sources Sought Notice (SSN) is in support of market research and procurement planning being conducted by the Naval Research Laboratory (NRL), Washington, DC. This SSN is for informational and planning purposes only and does not guarantee that this will be competed via SAM.GOV. The Government assumes NO financial responsibility for any costs incurred. A solicitation package is not available at this time.

OBJECTIVE: The intent of this RFI is to gauge industry interest and search for potential sources capable of fulfilling a requirement for Semiconductor Die Bonding and Vacuum Packaging System in accordance with the attached draft specifications. The Government is currently in the planning stages for this procurement and may continue to modify the language within the requirement as necessary. These specifications do not necessarily represent the final specifications.

CONTRACTOR RESPONSE FORMAT: Interested parties, at a minimum, shall supply all of the below required information in a Capability Statement. (Reference RFI N00173-26-RFI-KN02 in your response)

1. CONTACT INFORMATION 

  a) Company Name and Address

  b) Point of Contact for question/clarification

  c) Telephone Number and e-mail address

  d) Unique Entity ID and CAGE Code  

  e) PSC Code of the proposed solution (SEE https://psctool.us)

  f) Business Size/Socioeconomic Categories

2. TECHNICAL INFORMATION:

a) List of capabilities/resources relevant to the attached specifications.

b.) Any questions/suggestions related to the Specifications

3. COMMERCIALITY OF PROPOSED ITEM

a) Whether item(s) offered/proposed is a commercial item and is customarily used by the general public or non-government entities for the other than Government purposes.

b) Whether the item has been sold, leased, or licensed to the general public, and if so, identify one or more such sales, leases, or licenses to document the commerciality of the item.

c) If the manufacturer of the component, please confirm if Authorized Resellers are available.

ADDITIONAL REQUIREMENT DETAILS:

Responses should be no more than 10 pages and should be emailed to the Contract Specialist at kevin.nguyen3.civ@us.navy.mil; and to the Contrcting Officer at jamie.l.dixon8.civ@us.navy.mil. 

View original listing