Opportunity

Cornerstone #CS-26-1301

Solicitation for Advanced Microelectronics Packaging Prototype Projects (RESHAPE 2.0)

Buyer

Army Contracting Command - Rock Island

Posted

June 15, 2026

Respond By

July 15, 2026

Identifier

CS-26-1301

NAICS

541715, 334418

The Army Contracting Command - Rock Island is seeking proposals for the RESHAPE 2.0 initiative to advance US microelectronics packaging capabilities. - Government Buyer: - Department of Defense, Army Contracting Command - Rock Island - Supports Combat Capabilities Development Command Chemical Biological Center and IBAS Program - OEMs and Vendors: - No specific OEMs or vendors named; open to eligible consortium members - Products/Services Requested: - Prototype projects for advanced microelectronics packaging - Technologies include: - Copper-based silicon interposer technology - Fan-out wafer-level packaging - Silicon bridges - High-density interconnects and substrates - 2.5D/3D packaging and related secure solutions - Applications in RF phased array radar, EW sensors, AI, quantum technology, secure edge computing, and more - Unique/Notable Requirements: - Must be US-owned, trusted, and open-access advanced packaging ecosystem - Eligibility limited to consortium members - Significant participation required from nontraditional defense contractors, small businesses, or cost sharing per 10 U.S.C. 4022 - Compliance with export control laws - Multiple fixed-price OTAs with milestone-based payments - Estimated total value: $1.25 billion - Project duration up to 60 months, performed at awardee's facilities

Description

This solicitation, titled CIR CS-26-1301 RESHAPE 2.0, seeks proposals for prototype projects aimed at enhancing the nation's advanced microelectronics packaging capabilities. The initiative focuses on developing a US-owned, trusted, and open-access Advanced Packaging Ecosystem for low-volume production of advanced system integration and packaging secure solutions. The projects will address foundational technologies such as copper-based silicon interposer technology, fan-out wafer-level packaging, silicon bridges, high-density interconnects, and substrates, with applications in defense and national security. The government intends to award multiple fixed-price Other Transaction Agreements with milestone-based payments, with an estimated total value of $1.25 billion subject to fund availability. The period of performance for each project is up to 60 months, and the place of performance is at the awardees' facilities.

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