SBIR / STTR #12631

DARPA Solicitation for Advanced Thin-Film Heat Spreader Technology R&D

DARPA is seeking proposals for advanced thin-film heat spreader technology research and development to support high power semiconductor lasers and extreme temperature electronics. - Government Buyer: - Defense Advanced Research Projects Agency (DARPA), US Department of Defense - OEMs and Vendors: - No specific OEMs or vendors are named in the solicitation - Products/Services Requested: - Research and development of thin-film heat spreader technology - Key technical requirements: - High thermal conductivity (>1500 W/m·K) - Low thermal boundary resistance (<5 m²K/GW) - Electrically insulating - Scalable from small dies to full wafers - Integrable with various microsystem technologies at deposition temperatures below 450°C - Survivability and performance at temperatures exceeding 800°C - Uniform and conformal thickness (100 nm to 5 µm) - Low surface roughness (<10 nm RMS) - High electrical resistance - Low residual film stress and no substrate warpage - Laminate film stacks are acceptable; active cooling approaches are discouraged - Unique/Notable Requirements: - Technology must be suitable for high power semiconductor lasers and electronics operating in extreme environments - No specific part numbers or purchase quantities provided - Emphasis on scalability, integration, and survivability at high temperatures

Description

The Defense Advanced Research Projects Agency (DARPA) is soliciting innovative proposals for the research and development of thin-film heat spreader technology. The technology must have high thermal conductivity, low thermal boundary resistance, be electrically insulating, scalable, and integrable with various microsystem technologies at low deposition temperatures. The solicitation targets high power semiconductor lasers and extreme temperature electronics, requiring heat spreaders that perform well in environments exceeding 800°C. Proposals should develop heat spreader technologies suitable for both high power density and extreme temperature microsystems, with specific technical requirements including thermal conductivity greater than 1500 W/m·K and survivability at high temperatures.

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