SAM #W56KGU26CA004

Sole Source Contract for Direct Bonding of Compound Semiconductors in Dual-Band Infrared FPAs

This opportunity involves a sole source contract for advanced semiconductor bonding technology supporting Army infrared sensor development. - The U.S. Army Contracting Command-Aberdeen Proving Ground (ACCAPG), Division A, is procuring direct bonding services for compound semiconductors used in dual-band infrared focal plane arrays (FPAs). - DRS Network & Imaging Systems, LLC is identified as the sole source vendor, based on market research confirming their unique capability. - The contract is valued at approximately $8.4 million and will be funded by RDT&E Mantech for fiscal years 2026-2028. - The work aims to eliminate epoxy use in FPA production, improving sensor sensitivity and manufacturing yield. - The contract type is Cost-Plus-Fixed-Fee (CPFF). - Place of performance is Fort Belvoir, Virginia, with contracting managed from Aberdeen Proving Ground, Maryland. - No specific product part numbers or quantities are listed; the focus is on development, design, fabrication, and testing services. - The primary requirement is for direct bonding techniques in compound semiconductor manufacturing for dual-band infrared FPAs. - The period of performance is 36 months, covering FY26-FY28. - DRS Network & Imaging Systems, LLC is the only OEM named; no competing vendors are listed, but other advanced infrared sensor manufacturers may exist. - Further technical and procurement details are contained in the attached redacted J&A document.

Description

Redacted J&A for Direct Bonding for Compound Semiconductor for Use in Dual Band Infrared Focal Plane Arrays.

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