SAM #W56KGU26CA004

Award for Direct Bonding of Compound Semiconductors for Dual Band Infrared Focal Plane Arrays

This award notice details a Department of the Army contract for advanced semiconductor technology: - Government Buyer: - U.S. Department of Defense, Department of the Army, Army Materiel Command (AMC), Army Contracting Command (ACC), Aberdeen Proving Ground (ACC-APG), office W6QK ACC-APG - OEM and Vendor: - DRS Network & Imaging Systems LLC (OEM and awardee) - Products/Services Requested: - Direct bonding for compound semiconductor technology for use in dual band infrared focal plane arrays - No specific part numbers or product quantities provided - Notable Requirements: - Focus on advanced semiconductor bonding for dual band infrared imaging applications - Work to be performed at Fort Belvoir, Virginia - Award Value: - $8,321,532

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