SBIR / STTR #DPA26BZ02-NV008

DARPA SBIR Solicitation for Temperature-Hardened Electronics and Advanced Defense Technologies

DARPA is inviting small businesses to propose innovative solutions for temperature-hardened electronics and other advanced technologies for mission-critical defense and aerospace applications. - Government Buyer: - Defense Advanced Research Projects Agency (DARPA), Department of War (DoW) - DARPA Small Business Programs Office and Contracts Management Office (CMO) - OEMs and Vendors: - No specific OEMs or vendors are named; focus is on small business innovators and R&D providers - Products/Services Requested: - Temperature-hardened mixed-signal integrated circuits (ICs) for reliable operation at extreme temperatures (up to 800C) - Wide-bandgap materials such as SiC (Silicon Carbide) and GaN (Gallium Nitride) emphasized - Phase I: Feasibility demonstration of analog and digital IC components - Phase II: Development of high-performance Analog-to-Digital Converter (ADC) for extreme environments - Phase III: Commercialization and dual-use application development - Advanced thermal management heat spreaders (SMART) - Thin-film heat spreader technology with high thermal conductivity (>1500 W/mK), low deposition temperature (<450C), electrical insulation, survivability at 800C - Nanopore bioelectronics for next-generation proteomics - Single-molecule sensing and sequencing platform for high-accuracy, high-throughput protein sequencing - Compact wideband tunable RF filters - Wideband, power-efficient, tunable RF filter technologies for communications and electronic warfare - Automated co-design of radiation hardening and security for ICs - Manufacturable mixed-signal IC technology optimized for harsh environments and high temperatures - Low resource computing solutions - Repurposing legacy hardware for new capabilities and security - Unique/Notable Requirements: - Compliance with CMMC Level 2 (Self) - SBIR program eligibility (small business set-aside) - Emphasis on manufacturability, reliability, and commercialization potential - High-risk, high-reward R&D for national security - Award Amounts and Periods: - Phase I: $250,000 for 6 months - Phase II: $600,000–$900,000 for 12–36 months - Direct to Phase II and option years available - Place of Performance/Delivery: - DARPA Contracts Management Office, 675 N. Randolph Street, Arlington, VA 22203

Description

This solicitation is for the development of temperature-hardened electronics designed to ensure reliability in mission-critical applications. It is part of the Department of War's Small Business Innovation Research (SBIR) program under DARPA. The program includes multiple phases: Phase 1 (I), Phase 2 (II), and Phase 2S (SPII). Proposals must be submitted electronically through the Defense SBIR/STTR Innovation Portal (DSIP). The solicitation emphasizes high-risk, high-reward investments in science and technology to support national security.

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