SBIR / STTR #DPA26BZ02-NV005

DARPA SBIR: Advanced Thermal Management Spreaders for Microsystems (SMART)

DARPA is soliciting innovative small business proposals for the development of advanced thermal management technologies, specifically spreaders for microsystems with advanced thermal resilience (SMART), under the SBIR program. - Government Buyer: - Defense Advanced Research Projects Agency (DARPA), Department of War (DoW) - Sub-agency: DARPA Small Business Programs Office - Contracting Office: Contracts Management Office (CMO), 675 N. Randolph Street, Arlington, VA - OEMs and Vendors: - DARPA is the only agency and OEM explicitly mentioned - Products/Services Requested: - Research and development of conformal thin-film heat spreader technology for microsystems - Part number: DPA26BZ02-NV005 - Key technical requirements: - High thermal conductivity (>1500 W/mK) - Low deposition temperature (<450C) - Electrical insulation - Survivability at temperatures up to 800C - Scalability and low thermal boundary resistance - Phase I: 6-month feasibility study (technical reports, risk assessment, commercialization plan) - Phase II: 36-month development and demonstration (quarterly reports, demonstration, commercialization updates) - Unique or Notable Requirements: - Focus on R&D for high power density microsystems and extreme temperature electronics - Solutions must be manufacturable and scalable for defense and commercial applications - Proposals must be submitted electronically via the Defense SBIR/STTR Innovation Portal (DSIP) - Adherence to SBIR program guidelines and DARPA-specific instructions - Award and Performance: - Phase I: $250,000 for 6 months - Phase II: $600,000–$900,000 for up to 36 months - Potential for additional funding and commercialization in Phase III

Description

This solicitation is part of the SBIR program under DARPA, focusing on the development of spreaders for microsystems with advanced thermal resilience. It is a research and development effort aimed at enhancing thermal management technologies for microsystems. The solicitation is in pre-release status with a response deadline corresponding to a Unix timestamp of 1782316800000. Proposals must be submitted electronically through the Defense SBIR/STTR Innovation Portal (DSIP).

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