SAM #1333ND26NB030008JOFOC

Award for Custom Micro Specimens of Electroplated Copper and Lead-Free Solder for Mechanical Testing

NIST is procuring custom micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical fracture testing to support semiconductor industry R&D. - Government Buyer: - U.S. Department of Commerce, National Institute of Standards and Technology (NIST) - Material Measurement Laboratory, Applied Chemicals and Materials Division - Office of Acquisition and Agreements Management, Acquisition Management Division (AMD) - OEMs and Vendors: - Auburn University (sole source awardee) - Products Requested: - Custom micro specimens of electroplated copper films - Custom micro specimens of micro-sized lead-free solder - Ancillary parts: grip sections, pin holes, handles - No specific part numbers or quantities provided - Services Requested: - Progress reports, drafts of journal publications, conference presentations - Unique Requirements: - Specimens must be fabricated using NIST's proprietary designs - Intended for mechanical testing to fracture - Supports critical material property data for semiconductor R&D - Sole source justification: only Auburn University can meet technical requirements - Period of Performance: - Base period of 2 years, with a 1-year option - Places of Performance and Delivery: - NIST facility, Gaithersburg, Maryland - Boulder, Colorado - Auburn University, Auburn, Alabama

Description

In accordance with FAR 6.305(a) the attached justification is publically available within 14 days of contract award. This post will remain available for 30 days in accordance with FAR 6.305(d)(3). See attached redacted Justification For Other Than Full And Open Competition (JOFOC) for details.

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