DARPA #DPA26BZ02-NV005

DARPA Solicitation for Thin-Film Heat Spreader Technology R&D (SBIR Program)

DARPA is inviting small businesses to submit proposals for research and development in thin-film heat spreader technology: - Government Buyer: - Defense Advanced Research Projects Agency (DARPA), United States Department of Defense - Managed by the Small Business Programs Office - Program Details: - Part of the Small Business Innovation Research (SBIR) program - Focused on microsystems, power, and energy - Products/Services Requested: - Innovative research and development services to advance thermal resilience in microsystems - No specific products, part numbers, or purchase quantities identified - Unique Requirements: - Set aside for small businesses - Emphasis on advancing thermal management technology for microsystems - OEMs and Vendors: - No specific OEMs or vendors named in the solicitation

Description

The Defense Advanced Research Projects Agency (DARPA) is soliciting innovative proposals for the research and development of thin-film heat spreader technology. This opportunity is part of the Small Business Innovation Research (SBIR) program and focuses on microsystems, power, and energy. The solicitation is managed by the Small Business Programs Office and aims to advance thermal resilience in microsystems. Proposals must be submitted by June 24, 2026.

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