SAM #DARPA-SN-26-69

DARPA NGMM Shopping Notice for Innovative 3DHI Microsystem Design Solutions

This opportunity from DARPA seeks innovative solutions for the NGMM program focused on advanced 3DHI microsystem design. - Open call for post-competitive, awardable solutions - Emphasis on using the NGMM 3D Assembly Design Kit (3D-ADK) for mixed-material 3D-heterogeneously integrated (3DHI) microsystem design - Solutions must demonstrate compatibility with commercial Electronic Design Automation (EDA) tools - No specific OEMs, products, part numbers, or quantities are listed - Submissions are reviewed on a rolling basis, with potential for multiple awards - No specific period of performance or contract value provided - Work and contracting managed by DARPA at its Arlington, VA office

Description

Between the dates listed above, the DARPA NGMM program will be actively reviewing the ERIS Marketplace for innovative, post-competitive, awardable solutions that exercise the early-stage version of the NGMM 3D Assembly Design Kit (3D-ADK) for mixed-material 3D-heterogeneously integrated (3DHI) microsystem design with commercial Electronic Design Automation (EDA) tools. This is an active and immediate search for solutions. Submissions will be reviewed on a rolling basis, and the Government reserves the right to make one or more awards prior to the closing date of this notice.

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