SAM #2031zA26N00022

This notice announces a sole source procurement by the Bureau of Engraving and Printing (BEP) for specialized polymer plates used in currency production. - Sole source contract for BEP Part #2EG01287: CTIP Polymer Plates, Size-A Format AO (Extra Large Panel) - Size: 992x1114 mm - Thickness: 125 microns - Packaging: Box of 25 pieces - Intended for use in the Siderography Section - Only available from Koenig & Bauer Banknote Solutions SA (KBBS) - Procurement justified under FAR 13.106-1(b); not open to competition - No services included; product only - Delivery and contracting office: Bureau of Engraving and Printing, Washington, DC

OEM and Vendor - Koenig & Bauer Banknote Solutions SA (KBBS)

Product Details - BEP Part #2EG01287: CTIP Polymer Plate, Size-A Format AO, Extra Large Panel

Place of Performance/Delivery - Bureau of Engraving and Printing, 14th & C Street, SW, Washington, DC 20228

The Bureau of Engraving and Printing (BEP) Office of the Chief Procurement Officer (OCPO) on behalf of the Office of Supply Chain Management (OSCM) intends to award a sole source, firm-fixed-price contract for BEP Part Numbers:

2EG01287 - PLATES CTIP POLYMER SIZE-A FORMAT AO (EXTRA LARGE PANEL) SIZE: 992X1114 MM 125 MICRONS (BOX OF 25 PIECES) MPR-3099 FOR USE IN THE SIDEROGRAPHY SECTION(SOLE SOURCE FROM KBA).

The intended contractor is Koenig & Bauer Banknote Solutions SA (KBBS). The Government intends to award a sole source contract utilizing a Justification and Approval in accordance with FAR 13.106-1(b). A determination not to compete this requirement is solely within the discretion of the Government. Information received will be considered solely to determine whether to conduct a competitive procurement. Any cost associated with the preparation and submission of data or information or any other costs incurred in responding to this notice is the sole responsibility of the respondent and will not be reimbursed by the Government. Responses MUST be received NO LATER THAN 12:00 PM, Eastern Standard Time (EST), 30-MAR-2026. Additionally, interested sources must be registered and currently active in the System for Award Management (SAM), found at https://www/sam/gov. Responses MUST be submitted in writing ONLY via email to diane.rollins@treasury.gov and naweed.nezam@treasury.gov within the closing date/time of publication of this notice.