# Wisconsin Vendornet Platform #2027-UWMSN-01465-RFB

APxF Rev K3 Printed Circuit Board Assembly and Reflow

**Posted:** October 01, 2026
**Respond By:** October 09, 2026
**Identifier:** 2027-UWMSN-01465-RFB
**NAICS:** 334418

The University of Wisconsin–Madison is seeking bids for assembly and reflow of an APxF Rev K3 printed circuit board assembly.
- Buyer: University of Wisconsin–Madison, Madison, Dane County, Wisconsin.
- Requested service: APxF Rev K3 assembly and reflow.
- No OEM, vendor, part number, quantity, or additional technical specifications are identified in the notice.

### Description

The University of Wisconsin–Madison is requesting bids for the purchase of APxF Rev K3 Assembly and Reflow. Responses must be entered online through the solicitation link provided in the source. Questions must be directed to Eric Thomspon at ejthompson2@wisc.edu. The source lists NIGP 28724, Circuit Boards, Modular, Printed (PCB), and Proto.

[View original listing](https://vendornet.wi.gov/Bid/View/7c207886-28be-495f-acce-5039439c306e)