# SAM #1333ND26PNB30149JOFOC

Sole Source Procurement of High-Performance 3D Digital Image Correlation (DIC) System for NIST CHIPS Metrology Program

**Buyer:** DEPT OF COMMERCE NIST
**Posted:** September 25, 2026
**Identifier:** 1333ND26PNB30149
**NAICS:** 334516, 333242, 541715

NIST is announcing a sole source procurement for a high-performance 3D Digital Image Correlation (DIC) system to support the CHIPS Metrology program.
- Sole source contract awarded to Park Seungbae, identified as the only manufacturer meeting NIST's technical requirements
- System will measure in-situ, full-field displacement and strain of polymeric packaging compounds under thermal conditions
- Required features include integrated environmental chambers and projector systems
- Procurement includes delivery, installation, training, and a minimum one-year warranty
- Firm-fixed-price contract with a seven-month period of performance from award
- No competing vendors or products identified due to unique technical requirements

### Description

<p>In accordance with RFO 6.301(b), the attached justification is publically available within 14 days of contract award. This post will remain available for 30 days in accordance with RFO 6.301(c)(3). See attached redacted Justification For Other Than Full and Open Competition (JOFOC) for details.&nbsp;</p>

[View original listing](https://sam.gov/opp/7c9c36edd5484d7d961c928d73cff7de/view)