BPA #HQ072726AE003

DoD Blanket Purchase Agreement for Microelectronic PCB Fabrication and Assembly

This award represents a blanket purchase agreement (BPA) established to procure specialized printed circuit board (PCB) fabrication and assembly services tailored to microelectronic components. The recipient, Printed Circuits Corp., is recognized for their expertise in producing high-quality circuit boards supporting microelectronics, crucial for defense applications. The contract aims to deliver flexible, full-spectrum solutions that address the Department of Defense's needs for advanced microelectronic systems, enhancing operational capabilities and technology readiness. The scope encompasses the design, manufacturing, and assembly of microelectronic PCBs, ensuring reliability and performance for critical defense hardware. As a BPA, this contract facilitates streamlined purchasing over a period beginning in early 2026, allowing the DoD to efficiently obtain PCB fabrication services on an as-needed basis. While specific competitive details are not provided, blanket purchase agreements typically result from a competitive process to enable rapid and ongoing acquisition. The arrangement underscores the strategic importance of maintaining a responsive supply chain for cutting-edge microelectronic components essential to national security.

Description

PCB FABRICATION AND ASSEMBLY OF MICROELECTRONIC COMPONENTS TO PROVIDE FLEXIBLE, FULL-SPECTRUM MICROELECTRONICS SOLUTIONS TO MEET DEPARTMENT OF DEFENSE NEEDS.

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