Definitive Contract #HR001124C0305

DOD Awards $14.42M for Miniature Thermal Management Systems Development

This definitively contracted award, valued at a potential total of $14,415,291, was granted to HRL Laboratories, LLC by the Department of Defense (DoD) for the development of Miniature Integrated Thermal Management Systems for 3D Heterogeneous Integration (MINITHERMS3D). HRL Laboratories, known for its focus on advanced technology solutions, operates under the classification of 'Other Than Small Business'. The project is crucial for advancing thermal management techniques and enhancing 3D integration technology, making a significant contribution to the defense sector. There was no specific set-aside designation associated with this contract, which was awarded through full and open competition. The contract covers a range of deliverables, with a performance period extending from November 9, 2023, to May 8, 2025, with potential extensions until November 8, 2027. The work includes collaboration with key subcontractors like Micross Advanced Interconnect Technology LLC, which will provide wafer-level packaging services, Stanford University for fluidic chips proof-of-concept, and Global Communication Semiconductors LLC for GaN/SiC MPW lot. This collaboration emphasizes the importance of partnership in achieving the project objectives.

Description

MINIATURE INTEGRATED THERMAL MANAGEMENT SYSTEM FOR 3D HETEROGENEOUS INTEGRATION (MINITHERMS3D)

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