Award
University of Colorado PSC-S-141
Printed Wiring Board Assembly - UCB
Recipient
Multiple awards to seven bidders including DBM Technologies Inc, Pioneer Circuits, Spectrum Advanced Manufacturing, Jackson and Tull, Utah State University Research Foundation, Aeroflex Colorado Springs Inc, and Seakr Engineering Inc.
Awarded
May 10, 2016
Identifier
PSC-S-141
The University of Colorado at Boulder, specifically the Laboratory for Atmospheric and Space Physics (LASP), awarded multiple contracts for Printed Wiring Board (PWB) Assembly services. Seven vendors were awarded: DBM Technologies Inc, Pioneer Circuits Inc, Spectrum Laser & Technologies Inc, Jackson & Tull Chartered Engineers, Utah State University Research Foundation, Aeroflex Colorado Springs Inc, and Seakr Engineering Inc. The awards establish a pool of engineering/manufacturing firms to provide PWB assembly services including rigid and rigid-flex boards, with expected quantities ranging from 50 to 100 boards over the contract period. The services include assembly at prototype, engineering build, and flight build stages, with some boards requiring up to five assemblies during the program cycle. The initial contract term is one year with options to extend annually up to five years total. Vendors must comply with LASP, NASA, and program requirements, and work closely with LASP engineering and quality assurance teams. The contract allows for a one-time price increase per extension period and includes a process for adding new vendors annually until 2020. The solicitation was conducted as a Multi-Step Sealed Bid with technical and financial evaluation phases. The contract is managed by the University of Colorado Procurement Service Center, with contact Stuart Littlefield. The place of performance is Boulder, Colorado, at the LASP department.
Description
Printed Wiring Board Assembly (PWB) Assembly, as needed for our Boulder LASP Department