Montana Microfabrication Facility MSU-IFB-2026-0784

Montana Microfabrication Facility Chip Bonding Tool

The Montana Microfabrication Facility at Montana State University is procuring a chip bonding tool designed to assemble and package photonic integrated circuits (PICs) and related devices. This procurement involves a purchase of one chip bonding tool, including all associated costs such as shipping, tariffs, training, and university discounts. The award was made by Montana State University, Montana Microfabrication Facility, to Tresky Corporation. The product awarded is a chip bonding tool with a quantity of one. The contract emphasizes precise and repeatable alignment for assembling PICs, with a focus on controlled placement, bonding force, and programmable temperature ramps. The procurement process required bidders to comply with university terms, submit documentation, and certify nondiscrimination against firearm entities. The award is categorized under higher education, with NAICS codes 3002, 1502, and 1505. The primary contacts are Heather Modroo and Mary Hardin, with email addresses provided. The location of the award is associated with Montana State University, and the jurisdiction is Montana, US. The likely competitor companies include Montana Microfabrication Facility, with no other competitors listed.

Description

The Montana Microfabrication Facility is purchasing a tool for chip bonding to assemble and package photonic integrated circuits (PICs) and related devices.

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