Iowa State University of Science and Technology PO-1335672

HY910 20gram Thermal Conductive Glue, High-Performance Thermal Plaster, Silicone Viscous Adhesive Cooling Compound, H...

This purchase order, PO-1335672, was issued by Iowa State University of Science and Technology, a public college or university in Iowa, United States, to Amazon Com Services Inc (CYBUY). The order involves the procurement of 2 units of HY910 20gram Thermal Conductive Glue, High-Performance Thermal Plaster, Silicone Viscous Adhesive Cooling Compound, Heatsink Glue for GPU LED MOSFET 3D Printer IC Chipset, with a total obligated amount of $15.00. The order was placed on May 21, 2026, and is a single-transaction contract. The vendor, Amazon Services Inc, is awarded for the specified thermal management products, with no additional notable contract requirements mentioned.

Description

HY910 20gram Thermal Conductive Glue, High-Performance Thermal Plaster, Silicone Viscous Adhesive Cooling Compound, Heatsink Glue for GPU LED MOSFET 3D Printer IC Chipset